A Product Line of
Diodes Incorporated
ZXMN15A27K
Maximum Ratings
@T A = 25°C unless otherwise specified
Drain-Source voltage
Gate-Source voltage
Characteristic
Symbol
V DSS
V GS
Value
150
± 25
Unit
V
V
Single Pulsed Avalanche Energy
Single Pulsed Avalanche Energy
Repetitive Avalanche Energy
Repetitive Avalanche Current
Continuous Drain current
(Note 7)
(Note 7)
(Note 4)
(Note 4)
(Note 3)
V GS = 10V T A = 70 ° C (Note 3)
E AS
I AS
E AR
I AR
I D
55
4.3
3.0
4.3
2.55
2.0
mJ
A
mJ
A
A
(Note 2)
1.7
Pulsed Drain current
V GS = 10V (Note 4)
I DM
17.2
A
Continuous Source current (Body diode) (Note 2)
Pulsed Source current (Body diode) (Note 4)
I S
I SM
5.2
17.2
A
A
Thermal Characteristics
Characteristic
(Note 2)
Symbol
Value
4.2
33.6
Unit
Power dissipation
Linear derating factor
(Note 3)
P D
9.5
76.0
W
mW/ ° C
(Note 6)
(Note 2)
2.2
17.2
30.2
Thermal Resistance, Junction to Ambient
(Note 3)
R θ JA
13.1
° C/W
(Note 6)
58.1
Thermal Resistance, Junction to Lead
Operating and storage temperature range
(Note 5)
R θ JL
T J , T STG
2.06
-55 to 150
° C/W
° C
Notes:
2. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions. The device is
measured when operating in a steady-state condition.
3. Same as note 2, except the device is measured at t ≤ 10 sec.
4. Same as note 2, except the device is operating in a repetitive state with pulse width and duty cycle limited by maximum junction temperature.
5. Thermal resistance from junction to solder-point at the end of the drain lead.
6. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition..
7. UIS in production with L = 5.95mH, I AS = 4.3A, R G = 25 ? , V DD = 100V, starting T J = 25°C.
ZXMN15A27K
Document Number DS31978 Rev. 2 - 2
2 of 8
www.diodes.com
October 2009
? Diodes Incorporated
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